Solvent Based Epoxy Resin Mould Release Agent , Electrical Parts Mold Release Chemical

Our solvent-based epoxy resin mold release agent is specially formulated for electrical parts manufacturing, providing excellent surface finish and efficient demolding performance.

Epoxy electrical components are produced through the APG process (gel die casting) and serve primarily as insulation. The main raw materials include epoxy resin, curing agent, and silicon powder, mixed in specific proportions for approximately 2.5 hours.

• Lubekote-9035H: Oily release agent (wet film) with fast solvent evaporation, ideal for high-volume transformer production with strong wetting ability.
• Lubekote 9305: Oil-based release agent (wet mold) with moderate solvent volatilization, excellent for improving surface appearance of transformers.
• Lubekote 9072C: Thermosetting resin release agent (dry film) with strong mold adhesion and minimal surface scaling.

• No transfer to product parts
• Low odor formulation
• Eliminates knit lines
• Minimal mold buildup
• Superior surface quality

1. Thoroughly clean the mold in a well-ventilated area
2. Apply release agent to clean, dry cotton cloth
3. Gently wipe over mold surface (0.5 m² area)
4. Repeat with adjacent areas, ensuring overlap
5. Allow 15 minutes between coats for curing
6. Apply 4 total coats
7. Allow final cure for 30 minutes at room temperature (or 15 min at 60°C for improved durability)

Note: Reapply one coat when release becomes hesitant.

For industrial use only. Handle with appropriate precautions in well-ventilated areas.